During operation, IPM module inevitably generates amount of heat, and if the junction temperature gets too high, it can lead to performance decline or even failure. That’s why temperature monitoring is an essential part of IPM module design. Currently, EXSENSE silver termination NTC chip is widely used in IPM module as temperature sensing component, providing real-time temperature monitoring to ensure the safe operation of IPM under various working conditions.

In an IPM module, EXSENSE silver termination NTC chip is placed very strategically. Typically, the NTC chip and power chip are positioned on the substrate together. This is the core high-temperature zone when the module is working, which allows it to capture real junction temperature changes more accurately. Once the EXSENSE bare chip collects temperature information, the ADC converts it into a digital signal. This signal is then processed further and converted into a voltage signal that’s sent to the MCU. When the NTC chip detects that the junction temperature is approaching or exceeding preset temperature threshold, the MCU responds immediately, for example, by reducing the output power of IPM module to lower heat generation, ensuring stable operation within a safe temperature range. This shows that NTC chip plays a central role in temperature monitoring and protection in IPM module and is indispensable for its normal operation.

The fast response of EXSENSE silver termination NTC chip helps IPM module avoids damage from sudden overheating and prolonged high temperatures. The advantages of the NTC chip include:

1. High accuracy: The temperature measurement error of the IPM module NTC chip can be controlled within ±1%, capturing subtle temperature fluctuations of module to ensure its stable operation under high-frequency, heavy-load conditions and prolong device lifespan.

2. Small dimension: EXSENSE bare chip has a micro bare-die structure, making it ideal for the highly integrated, compact packaging of IPM module and aligning with the trend of miniaturization. The small dimension also provides more excellent sensitivity, improving temperature response speed.

With the support of EXSENSE silver termination NTC chip, IPM module can effectively avoid damage caused by temperatures runaway, greatly enhancing system reliability, reducing equipment failure risks, and lowering maintenance costs and downtime. As IPM module develops rapidly toward higher power density and higher integration, the demands on NTC temperature monitoring are becoming more stringent. Thanks to its excellent performance, the EXSENSE silver termination NTC chip can meet the needs of evolving IPM module and provide temperature sensing for performance upgrades in downstream applications such as electric drive for EV, industrial frequency conversion, and photovoltaic energy storage system.