FEATURES
DT series NTC thermistor is the newest development in chip NTC thermistors. The miniature package is designed for hybrid applications where bonding wire or Au/Sn solder is used as the attachment method. The terminations on the top and bottom of the thermistor are gold (Au) plated for the ultimate in hybrid designs and construction.
1. Adopt gold electronide, higher realiabilty, gold/aluminum/silver wire bonding.
2. High accuracy,can reach ±0.5%, ±1%, ±2%, ±3%.
3. High stability & reliability.
4. Small size, can be 0.3*0.3mm.
5. Fast response.
6. Customized sizes and parameters are avaliable.
APPLICATION
1. Bonding (infrared thermal reactor, IGBT, Thermal printer head, Integrate module, semiconductor module, power mould etc).
2. Hybrid designs and construction.
3. High Precision NTC Temperature sensor.
Electronic Parameter Specification
|
Part No.
|
R25℃(KΩ)
|
B(K)
|
Regular Size (mm)
L*W*T
|
Rated Power@25℃(mW)
(@25±0.5℃ in the still air)
|
Dissipation factor(δ)(mW/℃)
(T=25℃ in the still air）
|
Thermal time
constant (s)
|
|
DT502□3950A
|
5.0
|
3950
|
1.0*1.0*0.5
|
＜60mW
|
～1.2
|
≤3
|
|
DT103□3435B
|
10.0
|
3435
|
0.95*0.95*0.6
|
＜60mW
|
～1.2
|
≤3
|
|
DT103□3470A
|
10.0
|
3470
|
1.0*1.0*0.5
|
＜60mW
|
～1.2
|
≤3
|
|
DT103□3950A
|
10.0
|
3950
|
1.1*1.1*0.46
|
＜60mW
|
～1.2
|
≤3
|
|
DT203□3743A
|
20.0
|
3743
|
1.1*1.1*0.6
|
＜60mW
|
～1.2
|
≤3
|
|
DT303□3950A
|
30.0
|
3950
|
1.0*1.0*0.55
|
＜60mW
|
～1.2
|
≤3
|
|
DT473□4050A
|
47.0
|
4050
|
0.45*0.45*0.25
|
＜10mW
|
～0.2
|
≤2
|
|
DT503□3950A
|
50.0
|
3950
|
1.0*1.0*0.55
|
＜60mW
|
～1.2
|
≤3
|
|
DT104□3950A
|
100.0
|
3950
|
0.95*0.95*0.6
|
＜60mW
|
～1.2
|
≤3
|
|
DT104□3964F
|
100.0
|
3964
|
0.45*0.45*0.2
|
＜10mW
|
～0.2
|
≤2
|
|
DT104□4100A
|
100.0
|
4100
|
0.95*0.95*0.6
|
＜60mW
|
～1.2
|
≤3
|
In addition to the above dimensions and conventional resistance values, we are able to manufacture
the following range of products:
◆Resistance: 1kΩ ~ 1000kΩ
◆B value: 3200K ~ 4500K
◆Size: 0.3mm ~ 4.0mm
